PRODUCT LIST
1 - 36(36 in all)
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KAEDOKI -
Carbon Nano Fiber (CNF) for high conductivity : ALP-NH1 -
Silicon carbide (SiC) -
Low Thermal Resistance Thermal Interface Sheet（FiBCool®） -
Thermal Management Solutions for AI Servers
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Cooling-plate -
COSMO THRTMAL GAPFILLER -
Carbon Nano Fiber (CNF) for conductivity (HD) : ALP-NK1 -
Silicon, silicon compounds (Si, SiO, SiC, Si/C, etc.), and various other materials -
Graphene porous material GRAPHENE FOAM -
Thermalnite® (Fibrous Single-Crystal Aluminum Nitride) -
Radi-ex
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Hybrid Filler（Thermalnite® × Spherical AlN）
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FUJIPOLY SPACE QUALITY Low-Outgassing Thermal Interface Materials Compliant with Space Standards
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Stacked Low-Profile Heatsinks -
FGHP™: the world’s highest-performance ultra-thin vapor chamber -
Mold-Parts -
Silicone Thermal Conductive Gap Pad -
Graphene filler that gives thermal and electrical conductivity GRAPHENE FILLER -
https://www.meijo-nano.com/en/home
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Joining of dissimilar materials -
Direct-to-Chip -
Custom Aluminum Water-Cooled Heatsinks -
High Thermal Conductivity Thermal Interface Sheet -
Thermal interface material -
High Thermal Conductive Graphite Composite "COMPOROID®" for Next-Generation Thermal Management Solution -
Carbon Nano Fiber (CNF) for conductivity : ALP-NB1 -
Water-cooled heat sink sample -
A high heat conductor with more than twice the thermal conductivity of copper GRAPHENE BLOCK -
COSMO THERMAL GREASE -
Heat-sink -
Microchannel Cold Plate(Liquid Cooled Heatsink) -
High-Strength Aluminum Nitride (AlN) Ceramic Substrate -
Thermal Insulation Sheet -
UV-LED Cooling Heatsink -
Sealing plate for cylindrical lithium-ion batteries
1 - 36(36 in all)