PRODUCT LIST
1 - 36(36 in all)
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Hybrid Filler（Thermalnite® × Spherical AlN）
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Thermal Conductive Sheet GFP Series
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Radi-ex
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Thermal Grease GRS Series
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Silicon, silicon compounds (Si, SiO, SiC, Si/C, etc.), and various other materials -
Carbon Nano Fiber (CNF) for conductivity (HD) : ALP-NK1 -
COSMO THRTMAL GAPFILLER -
Microchannel Cold Plate(Liquid Cooled Heatsink) -
Silicone Thermal Conductive Gap Pad -
Carbon Nano Fiber (CNF) for high conductivity : ALP-NH1 -
Heat-sink -
Sealing plate for cylindrical lithium-ion batteries -
Custom Aluminum Water-Cooled Heatsinks -
Thermal Insulation Sheet -
KAEDOKI -
Direct-to-Chip -
Low Thermal Resistance Thermal Interface Sheet（FiBCool®） -
Cooling-plate -
High-Strength Aluminum Nitride (AlN) Ceramic Substrate -
Mold-Parts -
Thermal Gel Compound GEL Series
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COSMO THERMAL GREASE -
Thermal Conductive Sheet SLC series
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High Thermal Conductive Graphite Composite "COMPOROID®" for Next-Generation Thermal Management Solution -
Thermalnite® (Fibrous Single-Crystal Aluminum Nitride) -
Water-cooled heat sink sample -
Carbon Nano Fiber (CNF) for conductivity : ALP-NB1 -
https://www.meijo-nano.com/en/home
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Stacked Low-Profile Heatsinks -
Non-Silicone Thermal Conductive Putty Sheet
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Joining of dissimilar materials -
UV-LED Cooling Heatsink -
High Thermal Conductivity Thermal Interface Sheet -
Silicon carbide (SiC) -
FGHP™: the world’s highest-performance ultra-thin vapor chamber -
Silicone Encapsulant POT Series
1 - 36(36 in all)