Microchannel Cold Plate(Liquid Cooled Heatsink) United Precision Technologies
- Thermal Design / Technology (Analysis software, etc.)
- Heat Countermeasure Parts
- Heat Management Products / Systems (Heatsink, Radiator plate, etc.)
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Target Sector (English)
Semiconductor
Tester
Light Source
Supercomputer
Hydrogen Station -
Use Scenes (English)
Ideal for cooling in advanced industries where devices are increasingly high-power and compact.
- Semiconductor Field: Semiconductor testing equipment (handling increased power consumption) and lithography systems (preventing thermal distortion of lenses)
- Computing Field: Data center servers and HPC (Supercomputers) aiming for lightweight design and higher cooling efficiency
- Automotive Field: Power device cooling for Electric Vehicles (EVs) and Fuel Cell Vehicles (FCVs)
- Energy: Compact cooling units for hydrogen stations -
Sales point (English)
The combination of photo-etching and diffusion bonding delivers performance that surpasses conventional methods such as machining and brazing.
- Outstanding Cooling Performance: Microchannels with a minimum width of 70 μm enable heat dissipation of over 2 kW with a minimal size
- Ultimate Compactness & Thinness: Laminating thin sheets (from 30 μm thickness) achieves ultra-thin cold plates starting at just 3 mm, while minimizing weight increase
- High Reliability (Leak-Free): Atomic-level diffusion bonding eliminates the need for filler metals, ensuring strength equivalent to the base metal. This minimizes the risk of coolant leaks and aging
- Flexible Channel Design: Our die-less manufacturing process allows us to quickly deliver complex, optimized channel designs based on thermal simulations
| Size / capacity (English) | Products are custom-designed based on your required specifications. - Dimensions: Covers a wide range from small units (e.g., 20×40 mm) to large plates (e.g., 200×300 mm) - Thickness: Flexibly adjustable from 3 mm to over 100 mm by changing the number of laminated sheets (Max 1,000 layers) - Structure: Multi-layer parallel channels can be structured to optimize internal volume and pressure drop |
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| Notices (English) | - End-to-End Support: UPT engineers utilize thermal simulations from the early design stages to propose optimal channel layouts that maximize performance - High-End Position: Our diffusion bonding method is the ultimate choice for extreme environments where brazing material overflow or voids cannot be tolerated |
| Catalog PDF file |
United Precision Technologies
https://upt-co.com/- Japan exhibitors
- Real
- TECHNO-FRONTIER 2026
- THERMAL ENGINEERING JAPAN
- Booth number 3-A19