United Precision Technologies

Microchannel Cold Plate(Liquid Cooled Heatsink)

• Target Sector (English)

  Semiconductor
  Tester
  Light Source
  Supercomputer
  Hydrogen Station

• Use Scenes (English)

  Ideal for cooling in advanced industries where devices are increasingly high-power and compact.
  - Semiconductor Field: Semiconductor testing equipment (handling increased power consumption) and lithography systems (preventing thermal distortion of lenses)
  - Computing Field: Data center servers and HPC (Supercomputers) aiming for lightweight design and higher cooling efficiency
  - Automotive Field: Power device cooling for Electric Vehicles (EVs) and Fuel Cell Vehicles (FCVs)
  - Energy: Compact cooling units for hydrogen stations

• Sales point (English)

  The combination of photo-etching and diffusion bonding delivers performance that surpasses conventional methods such as machining and brazing.
  - Outstanding Cooling Performance: Microchannels with a minimum width of 70 μm enable heat dissipation of over 2 kW with a minimal size
  - Ultimate Compactness & Thinness: Laminating thin sheets (from 30 μm thickness) achieves ultra-thin cold plates starting at just 3 mm, while minimizing weight increase
  - High Reliability (Leak-Free): Atomic-level diffusion bonding eliminates the need for filler metals, ensuring strength equivalent to the base metal. This minimizes the risk of coolant leaks and aging
  - Flexible Channel Design: Our die-less manufacturing process allows us to quickly deliver complex, optimized channel designs based on thermal simulations