High-Strength Aluminum Nitride (AlN) Ceramic Substrate U-MAP/okamoto glass

For power semiconductor manufacturers, electronic component suppliers, substrate manufacturers, packaging companies, automotive and EV manufacturers, and engineers requiring highly reliable thermal management substrates.

Suitable for power semiconductors, AI servers, data centers, communication equipment, lasers, LEDs, automotive electronics, EVs, and industrial equipment requiring excellent thermal conductivity and mechanical reliability.

This high-strength aluminum nitride (AlN) ceramic substrate has been jointly developed by Okamoto Glass Co., Ltd. and U-MAP Co., Ltd. By utilizing U-MAP's proprietary Thermalnite® technology, the substrate is designed to achieve both excellent thermal conductivity and enhanced mechanical strength and fracture toughness. The exhibit introduces the concept for next-generation high-reliability thermal management substrates.