U-MAP/okamoto glass

For TIM manufacturers, thermal material suppliers, resin manufacturers, film manufacturers, compounders, and electronic material companies seeking collaborative development of next-generation high thermal conductivity TIMs and thermal management materials.

Designed for high-performance TIM development for AI servers, data centers, power semiconductors, communication equipment, automotive electronics, and EV applications. U-MAP supports collaborative development from material design through prototyping and evaluation.

This thermal interface sheet utilizes U-MAP's proprietary Thermalnite® and hybrid filler technology to form efficient thermal conduction networks within the material. In addition to high thermal conductivity, U-MAP optimizes processability and practical performance through customized material design. Collaborative development is available, including filler formulation, resin selection, and target thermal conductivity.

For power semiconductor manufacturers, electronic component suppliers, substrate manufacturers, packaging companies, automotive and EV manufacturers, and engineers requiring highly reliable thermal management substrates.

Suitable for power semiconductors, AI servers, data centers, communication equipment, lasers, LEDs, automotive electronics, EVs, and industrial equipment requiring excellent thermal conductivity and mechanical reliability.

This high-strength aluminum nitride (AlN) ceramic substrate has been jointly developed by Okamoto Glass Co., Ltd. and U-MAP Co., Ltd. By utilizing U-MAP's proprietary Thermalnite® technology, the substrate is designed to achieve both excellent thermal conductivity and enhanced mechanical strength and fracture toughness. The exhibit introduces the concept for next-generation high-reliability thermal management substrates.

Filler manufacturers, resin manufacturers, compounders, TIM manufacturers, film manufacturers, and electronic material suppliers developing thermal management materials. Recommended for engineers seeking higher thermal conductivity, lower filler loading, improved processability, mechanical strength, and reduced thermal resistance.

Thermal interface sheets, gap fillers, thermal grease, adhesives, encapsulants, thermoplastics, adhesive films, and PCB substrates. Suitable for AI servers, data centers, power semiconductors, EVs, automotive electronics, communication devices, and semiconductor manufacturing equipment requiring advanced thermal management.

Hybrid Filler combines short Thermalnite® fibers with spherical AlN particles. The fibrous filler bridges spherical particles to help form efficient thermal conduction networks. While conventional high-loading spherical filler designs may cause viscosity increase, poor processability, and reduced mechanical properties, this hybrid approach supports high thermal performance while maintaining base material properties at lower filler loading. Small-particle and large-particle options are available depending on application requirements.

TIM manufacturers, electronic component suppliers, power semiconductor manufacturers, automotive and EV companies, AI server and data center developers seeking lower thermal resistance and improved thermal performance.

Suitable for power semiconductors, AI servers, data centers, communication equipment, automotive ECUs, LED modules, and power devices. Used as a thermal interface material (TIM) between heat-generating components and heat sinks to reduce contact thermal resistance.

This thermal interface sheet utilizes U-MAP's proprietary Thermalnite® technology and thermal conduction network design to achieve excellent low thermal resistance. Fibrous fillers create efficient thermal pathways, improving heat transfer while maintaining flexibility and excellent surface conformity. High electrical insulation makes it suitable for AI servers, power semiconductors, and automotive electronics.

For filler manufacturers, resin manufacturers, compounders, TIM manufacturers, electronic material suppliers, research institutes, and engineers developing next-generation thermal management materials and high-performance composites.

Suitable for hybrid fillers, thermal interface materials (TIM), thermal grease, adhesives, encapsulants, thermoplastics, and other thermal management materials used in AI servers, data centers, power semiconductors, EVs, automotive electronics, and communication equipment.

Thermalnite® is U-MAP's proprietary fibrous single-crystal aluminum nitride (AlN). Combining high thermal conductivity with electrical insulation, its fibrous structure bridges filler particles to create efficient thermal conduction networks within composite materials. It enables lower filler loading while maintaining thermal performance, processability, and mechanical properties, making it a core material for hybrid filler design and advanced thermal management materials.