Thermalnite® (Fibrous Single-Crystal Aluminum Nitride) U-MAP/okamoto glass

For filler manufacturers, resin manufacturers, compounders, TIM manufacturers, electronic material suppliers, research institutes, and engineers developing next-generation thermal management materials and high-performance composites.

Suitable for hybrid fillers, thermal interface materials (TIM), thermal grease, adhesives, encapsulants, thermoplastics, and other thermal management materials used in AI servers, data centers, power semiconductors, EVs, automotive electronics, and communication equipment.

Thermalnite® is U-MAP's proprietary fibrous single-crystal aluminum nitride (AlN). Combining high thermal conductivity with electrical insulation, its fibrous structure bridges filler particles to create efficient thermal conduction networks within composite materials. It enables lower filler loading while maintaining thermal performance, processability, and mechanical properties, making it a core material for hybrid filler design and advanced thermal management materials.