Hybrid Filler（Thermalnite® × Spherical AlN） U-MAP/okamoto glass

Filler manufacturers, resin manufacturers, compounders, TIM manufacturers, film manufacturers, and electronic material suppliers developing thermal management materials. Recommended for engineers seeking higher thermal conductivity, lower filler loading, improved processability, mechanical strength, and reduced thermal resistance.

Thermal interface sheets, gap fillers, thermal grease, adhesives, encapsulants, thermoplastics, adhesive films, and PCB substrates. Suitable for AI servers, data centers, power semiconductors, EVs, automotive electronics, communication devices, and semiconductor manufacturing equipment requiring advanced thermal management.

Hybrid Filler combines short Thermalnite® fibers with spherical AlN particles. The fibrous filler bridges spherical particles to help form efficient thermal conduction networks. While conventional high-loading spherical filler designs may cause viscosity increase, poor processability, and reduced mechanical properties, this hybrid approach supports high thermal performance while maintaining base material properties at lower filler loading. Small-particle and large-particle options are available depending on application requirements.