High Thermal Conductivity Thermal Interface Sheet U-MAP/okamoto glass

For TIM manufacturers, thermal material suppliers, resin manufacturers, film manufacturers, compounders, and electronic material companies seeking collaborative development of next-generation high thermal conductivity TIMs and thermal management materials.

Designed for high-performance TIM development for AI servers, data centers, power semiconductors, communication equipment, automotive electronics, and EV applications. U-MAP supports collaborative development from material design through prototyping and evaluation.

This thermal interface sheet utilizes U-MAP's proprietary Thermalnite® and hybrid filler technology to form efficient thermal conduction networks within the material. In addition to high thermal conductivity, U-MAP optimizes processability and practical performance through customized material design. Collaborative development is available, including filler formulation, resin selection, and target thermal conductivity.