Low Thermal Resistance Thermal Interface Sheet（FiBCool®） U-MAP/okamoto glass
- Power Supply Parts
- Semiconductor
- Thermal Design / Technology (Analysis software, etc.)
- Heat Countermeasure Parts
- Heat Management Materials (Substrate, Elastic Materials, etc.)
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Target Sector (English)
TIM manufacturers, electronic component suppliers, power semiconductor manufacturers, automotive and EV companies, AI server and data center developers seeking lower thermal resistance and improved thermal performance.
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Use Scenes (English)
Suitable for power semiconductors, AI servers, data centers, communication equipment, automotive ECUs, LED modules, and power devices. Used as a thermal interface material (TIM) between heat-generating components and heat sinks to reduce contact thermal resistance.
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Sales point (English)
This thermal interface sheet utilizes U-MAP's proprietary Thermalnite® technology and thermal conduction network design to achieve excellent low thermal resistance. Fibrous fillers create efficient thermal pathways, improving heat transfer while maintaining flexibility and excellent surface conformity. High electrical insulation makes it suitable for AI servers, power semiconductors, and automotive electronics.
| Size / capacity (English) | Sheet thickness: Available according to application requirements. Custom dimensions and specifications are available upon request. |
|---|---|
| Notices (English) | Customization is available according to application requirements. Samples and thermal performance evaluations are available upon request. |
| Catalog PDF file |
U-MAP/okamoto glass
https://umap-corp.com/- Japan exhibitors
- Real
- TECHNO-FRONTIER 2026
- THERMAL ENGINEERING JAPAN
- Booth number 3-F21