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DATE
July 15(Wed) - 17(Fri), 2026
VENUE
Tokyo Big Sight West Halls 1, 2, 3

Stacked Low-Profile Heatsinks Kawaso Texcel

  • Motor
  • Capacitor
  • Un-Interrupting Power Source (UPS)
  • Semiconductor
  • Device/Element
  • Thermal Design / Technology (Analysis software, etc.)
  • Heat Countermeasure Parts
  • Heat Management Materials (Substrate, Elastic Materials, etc.)
  • Heat Management Products / Systems (Heatsink, Radiator plate, etc.)
  • fuel cell
  • High-energy-density battery technology
  • Target Sector (English)

    Heavy Industry & Energy
    Transportation & Mobility Infrastructure
    Power Electronics
    Light Sources & Optical Equipment
    Industrial Equipment & Production Lines
    Testing & Evaluation Equipment
    AI & Data Centers
    Semiconductor Manufacturing Equipment

  • Use Scenes (English)

    Perfectly matches the growing needs for space-saving equipment environments and lightweight heatsinks.

  • Sales point (English)

    An ultra-thin design with a thickness of just 3.4 mm. While our standard lineup features a 3-layer structure, we also offer custom solutions tailored to your required specifications and performance—including modifications to size, thickness, and even higher multi-layer configurations.

Size / capacity (English) Size: 78 mm × 88 mm

Thickness: 3.4 mm

Weight: 285 g

Kawaso Texcel

https://www.kawaso-texcel.co.jp/
  • Japan exhibitors
  • Real
  • TECHNO-FRONTIER 2026
  • THERMAL ENGINEERING JAPAN
  • Booth number 3-F23