Kawaso Texcel

Heavy Industry & Energy
Transportation & Mobility Infrastructure
Power Electronics
Light Sources & Optical Equipment
Industrial Equipment & Production Lines
Testing & Evaluation Equipment
AI & Data Centers
Semiconductor Manufacturing Equipment

[Heavy Industry & Energy]
Thermal density management for high-power semiconductors (such as IEGTs) that control high-output motors.

[Power Electronics]
Cooling for modularized heat sources in large-scale AC/DC conversion circuits responsible for grid stabilization.

[Light Sources & Optical Equipment]
Strict temperature control to prevent lifespan degradation associated with high-density LED packaging.

[Industrial Equipment & Production Lines]
Maintaining machining accuracy by eliminating thermal displacement and distortion of the machinery itself, as well as thermal insulation for process temperatures.

Improving process speeds and suppressing thermal impacts on the surrounding environment.

Cooling solutions that create highly reproducible environments based on the strict quality standards of automakers and other industries.

[AI & Data Centers]
Cooling for ultra-high heat dissipation chips (GPUs/CPUs).

[Semiconductor Manufacturing Equipment]
Etching and Plasma CVD Systems: Ensuring wafer temperature uniformity.

Ion Implantation Systems: Cooling high-energy collision heat.

1. Flexible Fluid Channel Design (Customizable Flow Paths)
Thanks to our ability to freely design and machine fluid channels, we can achieve significantly more uniform cooling compared to conventional air-cooled systems or heat sinks with embedded pipes.

2. End-to-End Solutions: From Design and Manufacturing to Verification
With our in-house R&D department, the "Heat Sink Lab," we are fully equipped with facilities to conduct verification tests under a wide range of conditions. This allows us to handle everything from prototype design and thermal analysis to practical demonstration and validation testing in-house.

3. Working with a Wide Range of Materials
We offer liquid cooling heat sinks in various materials, including aluminum, copper, and stainless steel. We can propose the optimal design using the material that best matches your specific requirements.

Heavy Industry & Energy
Transportation & Mobility Infrastructure
Power Electronics
Light Sources & Optical Equipment
Industrial Equipment & Production Lines
Testing & Evaluation Equipment
AI & Data Centers
Semiconductor Manufacturing Equipment

【Common Challenges with Heatsinks】

"There’s no way to check the internal condition of the heatsink..."

"I'm worried about aluminum corrosion..."

"If only we knew the exact time to replace the heatsink..."

To solve these challenges, we developed "KAEDOKI."
A measurement kit that allows you to visually verify the perfect time for heatsink replacement.

Quick and Easy Replacement Timing & Lifespan Measurement
By integrating "KAEDOKI" into your equipment's piping, you can visually monitor the internal condition of the heatsink's flow channels.

Heavy Industry & Energy
Transportation & Mobility Infrastructure
Power Electronics
Light Sources & Optical Equipment
Industrial Equipment & Production Lines
Testing & Evaluation Equipment
AI & Data Centers
Semiconductor Manufacturing Equipment

Perfectly matches the growing needs for space-saving equipment environments and lightweight heatsinks.

An ultra-thin design with a thickness of just 3.4 mm. While our standard lineup features a 3-layer structure, we also offer custom solutions tailored to your required specifications and performance—including modifications to size, thickness, and even higher multi-layer configurations.

Heavy Industry & Energy

Transportation & Infrastructure

Power Electronics

Light Sources & Optical Equipment

Industrial Equipment & Production Lines

Testing & Evaluation Equipment

AI & Data Centers

Semiconductor Manufacturing Equipment

Industrial & Production Lines (UV Curing & Bonding)

3D Printers (SLA)

Medical, Biotech & Analytical Fields

Disinfection & Water Purification (Deep UV: UV-C)

Exposure Equipment (Semiconductor & PCB Manufacturing)

By ensuring uniform cooling across the heatsink surface, variations in UV light output from each lamp are minimized, allowing UV energy to be efficiently directed toward the target object.
To maximize the performance of the UV irradiator, a flow channel design with minimal surface temperature variation is essential. Custom machining for LED mounting holes is available.