Custom Aluminum Water-Cooled Heatsinks Kawaso Texcel
- Motor
- Power Supply Parts
- Capacitor
- Switching Power Supply
- High Voltage Power Supply
- Un-Interrupting Power Source (UPS)
- Semiconductor
- Device/Element
- Thermal Design / Technology (Analysis software, etc.)
- Heat Countermeasure Parts
- Heat Management Materials (Substrate, Elastic Materials, etc.)
- Heat Management Products / Systems (Heatsink, Radiator plate, etc.)
-
Target Sector (English)
Heavy Industry & Energy
Transportation & Mobility Infrastructure
Power Electronics
Light Sources & Optical Equipment
Industrial Equipment & Production Lines
Testing & Evaluation Equipment
AI & Data Centers
Semiconductor Manufacturing Equipment -
Use Scenes (English)
[Heavy Industry & Energy]
Thermal density management for high-power semiconductors (such as IEGTs) that control high-output motors.
[Power Electronics]
Cooling for modularized heat sources in large-scale AC/DC conversion circuits responsible for grid stabilization.
[Light Sources & Optical Equipment]
Strict temperature control to prevent lifespan degradation associated with high-density LED packaging.
[Industrial Equipment & Production Lines]
Maintaining machining accuracy by eliminating thermal displacement and distortion of the machinery itself, as well as thermal insulation for process temperatures.
Improving process speeds and suppressing thermal impacts on the surrounding environment.
Cooling solutions that create highly reproducible environments based on the strict quality standards of automakers and other industries.
[AI & Data Centers]
Cooling for ultra-high heat dissipation chips (GPUs/CPUs).
[Semiconductor Manufacturing Equipment]
Etching and Plasma CVD Systems: Ensuring wafer temperature uniformity.
Ion Implantation Systems: Cooling high-energy collision heat. -
Sales point (English)
1. Flexible Fluid Channel Design (Customizable Flow Paths)
Thanks to our ability to freely design and machine fluid channels, we can achieve significantly more uniform cooling compared to conventional air-cooled systems or heat sinks with embedded pipes.
2. End-to-End Solutions: From Design and Manufacturing to Verification
With our in-house R&D department, the "Heat Sink Lab," we are fully equipped with facilities to conduct verification tests under a wide range of conditions. This allows us to handle everything from prototype design and thermal analysis to practical demonstration and validation testing in-house.
3. Working with a Wide Range of Materials
We offer liquid cooling heat sinks in various materials, including aluminum, copper, and stainless steel. We can propose the optimal design using the material that best matches your specific requirements.
| Size / capacity (English) | Minimum Size: 60 mm × 60 mm Maximum Size: 2,000 mm × 1,000 mm (Other sizes available upon request) |
|---|
Kawaso Texcel
https://www.kawaso-texcel.co.jp/- Japan exhibitors
- Real
- TECHNO-FRONTIER 2026
- THERMAL ENGINEERING JAPAN
- Booth number 3-F23
