Thermal Management Solutions for AI Servers FUJIPOLY Fuji Polymer Industries

This product is designed for engineers and manufacturers developing AI servers, data centers, high-performance computing (HPC) systems, and networking equipment requiring advanced thermal management. It is particularly suitable for designers of optical transceivers, memory modules, GPUs, CPUs, and other high-power electronic devices where efficient heat dissipation and repeated insertion/removal are essential. The products are also ideal for thermal, mechanical, and hardware design engineers seeking reliable thermal interface materials that improve cooling performance, system reliability, and maintenance efficiency in next-generation AI infrastructure.

SLIDING TIM is designed for thermal management between optical transceivers and cooling components in AI servers. It combines excellent thermal conductivity with low friction, enabling smooth insertion and removal while maintaining stable thermal performance after repeated mating cycles. The High-Recovery Thermal Interface Sheet is used between memory modules and cold plates to efficiently transfer heat while maintaining reliable contact through its excellent recovery characteristics. These products are ideal for AI servers, data centers, HPC systems, and networking equipment where high-performance cooling, long-term reliability, and easy maintenance are critical.

・Combines excellent thermal conductivity with outstanding sliding performance.
・Maintains stable thermal performance after repeated insertion and removal.
・Low-friction, non-tacky surface enables smooth assembly and maintenance.
・High recovery and low hardness ensure reliable contact with minimal stress on components.
・Low compression set maintains long-term thermal performance and reliability.
・Efficiently transfers heat from optical transceivers and memory modules to cold plates.
・Optimized for AI servers, data centers, HPC systems, and other high-performance electronic equipment requiring advanced thermal management.
・Contributes to improved cooling efficiency, system reliability, and serviceability.