FUJIPOLY Fuji Polymer Industries

This product is designed for companies and research organizations involved in the development, design, and manufacturing of spacecraft, satellites, launch vehicles, semiconductor manufacturing equipment, and analytical instruments operating in vacuum environments. It is particularly suitable for customers seeking to prevent contamination, optical fogging, and malfunction of precision components caused by outgassing. FUJIPOLY SPACE QUALITY is also ideal for aerospace engineers, researchers, and manufacturers that require materials compliant with international space standards adopted by organizations such as JAXA, NASA, and ESA. Available as standard catalog products rather than custom-made solutions, these materials enable customers to achieve space-grade reliability while reducing development time and cost.

FUJIPOLY SPACE QUALITY materials are used in satellites, space probes, space station equipment, and other aerospace applications where extremely low outgassing is essential. They are also suitable for high-vacuum environments such as semiconductor manufacturing equipment, vacuum chambers, optical devices, and analytical instruments. By minimizing the release of volatile substances, these materials help prevent contamination of lenses, sensors, and other sensitive components while maintaining stable operation of precision equipment. In addition, their excellent thermal conductivity and stable thermal resistance characteristics make them ideal for heat transfer applications between heat-generating components and heat sinks. These materials are well suited for any advanced industrial application requiring long-term reliability and exceptional performance under severe environmental conditions.

FUJIPOLY SPACE QUALITY materials are high-reliability thermal interface materials engineered with advanced polymer formulations that minimize outgassing in vacuum environments. They comply with the ASTM E595 material evaluation standard, meeting strict requirements of Total Mass Loss (TML) ≤ 1.00% and Collected Volatile Condensable Materials (CVCM) ≤ 0.10%. The materials satisfy international space standards adopted by organizations including JAXA, NASA, and ESA and are available in a broad lineup of standard catalog products. FUJIPOLY also conducts comprehensive evaluations using its proprietary vacuum measurement system, which simulates the harsh conditions of space. Heat cycle testing has demonstrated stable thermal resistance characteristics even after repeated temperature cycling, proving the materials’ excellent durability. These features deliver outstanding thermal performance and exceptional reliability in extreme vacuum and temperature environments.

This product is designed for engineers and manufacturers developing AI servers, data centers, high-performance computing (HPC) systems, and networking equipment requiring advanced thermal management. It is particularly suitable for designers of optical transceivers, memory modules, GPUs, CPUs, and other high-power electronic devices where efficient heat dissipation and repeated insertion/removal are essential. The products are also ideal for thermal, mechanical, and hardware design engineers seeking reliable thermal interface materials that improve cooling performance, system reliability, and maintenance efficiency in next-generation AI infrastructure.

SLIDING TIM is designed for thermal management between optical transceivers and cooling components in AI servers. It combines excellent thermal conductivity with low friction, enabling smooth insertion and removal while maintaining stable thermal performance after repeated mating cycles. The High-Recovery Thermal Interface Sheet is used between memory modules and cold plates to efficiently transfer heat while maintaining reliable contact through its excellent recovery characteristics. These products are ideal for AI servers, data centers, HPC systems, and networking equipment where high-performance cooling, long-term reliability, and easy maintenance are critical.

・Combines excellent thermal conductivity with outstanding sliding performance.
・Maintains stable thermal performance after repeated insertion and removal.
・Low-friction, non-tacky surface enables smooth assembly and maintenance.
・High recovery and low hardness ensure reliable contact with minimal stress on components.
・Low compression set maintains long-term thermal performance and reliability.
・Efficiently transfers heat from optical transceivers and memory modules to cold plates.
・Optimized for AI servers, data centers, HPC systems, and other high-performance electronic equipment requiring advanced thermal management.
・Contributes to improved cooling efficiency, system reliability, and serviceability.