Direct-to-Chip MOLE'S ACT INC
- Processing Technologies
- Semiconductor
- Automotive
- Design Technology
- Thermal Design / Technology (Analysis software, etc.)
- Thermal Design Support System
- Heat Countermeasure Parts
- Heat Management Materials (Substrate, Elastic Materials, etc.)
- Heat Management Products / Systems (Heatsink, Radiator plate, etc.)
-
Target Sector (English)
・AI data center
・electric vehicle
・power electronics -
Use Scenes (English)
・HPC/GPU rack cooling
・EV battery pack cooling, inverter cooling
・power electronics compatible with high heat flux -
Sales point (English)
・[Low Cost] aluminum version
・[Custom Design] arbitrary design of internal cooling channels
・[High Durability] durability from joint strength, long-term stability
| Size / capacity (English) | 150×85×15 ※customizable ※500×500×500 we can even handle the size |
|---|---|
| Notices (English) | ・cooling ・heat exchange ・liquid cooling ・hollow parts |
MOLE'S ACT INC
https://www.moles-act.co.jp- Japan exhibitors
- Real
- TECHNO-FRONTIER 2026
- THERMAL ENGINEERING JAPAN
- Booth number 3-D26