MOLE'S ACT INC
https://www.moles-act.co.jp- Japan exhibitors
- Real
- TECHNO-FRONTIER 2026
- THERMAL ENGINEERING JAPAN
- Booth number 3-D26
Diffusion bonding technology makes it possible to create arbitrary spaces within metals and non-ferrous metals that are difficult to process using conventional methods. Diffusion bonding technology enables the development of countermeasures and technologies that allow for proper thermal management against various thermal problems. By laminating plates with microchannels and integrating them into a single structure through diffusion bonding, it is possible to manufacture highly efficient and airtight heat exchangers.
Diffusion-bonded products, which do not use brazing materials or adhesives, ensure stable reliability even in harsh high-temperature and high-pressure environments.
Our company can handle the entire process of diffusion-bonded parts, from material procurement to finished products.
We also offer appropriate proposals based on our extensive experience in single-piece orders, mass production, and various materials.
Our booth showcases bonded products for thermal countermeasures in various fields.
If you have any questions about thermal problems, please visit our booth.
Exhibit Product
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Cooling-plate
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Target Sector (English)
・AI data center
・electric vehicle
・power electronics -
Use Scenes (English)
・HPC/GPU rack cooling
・EV battery pack cooling, inverter cooling
・power electronics compatible with high heat flux -
Sales point (English)
・[Custom Design] arbitrary design of internal cooling channels
・[High Durability] durability from joint strength, long-term stability
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Target Sector (English)
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Direct-to-Chip
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Target Sector (English)
・AI data center
・electric vehicle
・power electronics -
Use Scenes (English)
・HPC/GPU rack cooling
・EV battery pack cooling, inverter cooling
・power electronics compatible with high heat flux -
Sales point (English)
・[Low Cost] aluminum version
・[Custom Design] arbitrary design of internal cooling channels
・[High Durability] durability from joint strength, long-term stability
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Target Sector (English)
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Heat-sink
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Target Sector (English)
・power electronics
・5G/6G communication base station
・laser processing machines for industry and medical use -
Use Scenes (English)
・EV inverter air cooling
・heat dissipation for high-power amplifiers in 5G/6G base stations
・cooling for high heat flux zones -
Sales point (English)
・[Custom Design] arbitrary design of internal cooling channels
・[High Durability] durability from joint strength, long-term stability
・[Dissimilar Material Joining] Optimizing thermal conductivity with Al + Cu, etc.
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Target Sector (English)
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Joining of dissimilar materials
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Target Sector (English)
・electric vehicle
・semiconductor
・medical device
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Use Scenes (English)
・EV inverter, cooling parts
・high thermal conductivity parts due to higher semiconductor output
・clean joining without contamination for medical devices -
Sales point (English)
・[Custom Design] optimize performance during the design stage
・[Composite Performance] achieving lightweight, increased strength, and high thermal conductivity
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Target Sector (English)
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Mold-Parts
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Target Sector (English)
・electric vehicle
・semiconductor
・electronic components -
Use Scenes (English)
・EV aluminum housing, motor precision mold parts
・precision mold parts for semiconductor equipment
・connector precision mold parts -
Sales point (English)
・[Microchannel Formation] improved mold cooling, shorter molding cycle
・[High Heat Exchange] reduces mold damage and extends mold life
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Target Sector (English)