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DATE
July 15(Wed) - 17(Fri), 2026
VENUE
Tokyo Big Sight West Halls 1, 2, 3

Joining of dissimilar materials MOLE'S ACT INC

  • Motor
  • Processing Technologies
  • Semiconductor
  • Design Technology
  • Thermal Design / Technology (Analysis software, etc.)
  • Heat Countermeasure Parts
  • Heat Management Materials (Substrate, Elastic Materials, etc.)
  • Heat Management Products / Systems (Heatsink, Radiator plate, etc.)
  • fuel cell
  • Target Sector (English)

    ・electric vehicle
    ・semiconductor
    ・medical device

  • Use Scenes (English)

    ・EV inverter, cooling parts
    ・high thermal conductivity parts due to higher semiconductor output
    ・clean joining without contamination for medical devices

  • Sales point (English)

    ・[Custom Design] optimize performance during the design stage
    ・[Composite Performance] achieving lightweight, increased strength, and high thermal conductivity

Size / capacity (English) ※customizable
※500×500×500 we can even handle the size
Notices (English) ・joining different materials
・custom design
・heat exchange
・hollow parts

MOLE'S ACT INC

https://www.moles-act.co.jp
  • Japan exhibitors
  • Real
  • TECHNO-FRONTIER 2026
  • THERMAL ENGINEERING JAPAN
  • Booth number 3-D26