Carbon Nano Fiber (CNF) for conductivity (HD) : ALP-NK1 ALMEDIO

・Automotive manufacturers and automotive parts manufacturers (needs for lightweighting and increasing strength)
・Electronic component manufacturers (antistatic and conductive applications)
・Semiconductor-related companies (FOUPs, transport containers, ESD countermeasures)
・Battery and energy-related manufacturers (heat dissipation and conductive materials)
・Resin compound manufacturers (functional filler applications)
・Precision equipment manufacturers (reinforcement of thin-walled and micro-components)
・Home appliance manufacturers (lightweighting and increasing rigidity of housings)
・Aerospace-related manufacturers (high-strength, lightweight composite materials)
・Sports and leisure goods manufacturers (high-performance materials)
・EMI/electromagnetic wave countermeasure material manufacturers (shielding and absorption applications)
・Chemical manufacturers (composite material development and dispersion technology applications)

• Improving the strength and rigidity of resin molded products (lightweighting and thinning)
• Lightweighting and increasing the strength of automotive parts (brackets, covers, etc.)
• Antistatic and conductive properties of electronic components (ESD countermeasures)
• Static electricity countermeasures and improved durability of semiconductor transport containers (FOUPs)
• Improved heat dissipation of heat sinks and housings (thermal countermeasures materials)
• Conductive additives for battery-related applications
• Use as EMI shielding material and electromagnetic wave absorbing material
• Reinforcement of precision and micro-components (connectors, small gears, etc.)
• Reduced wear and extended lifespan of sliding parts
• Improving the performance of composite materials such as CFRP (improved interlayer strength)
• Adding functionality to transport materials such as conductive trays and FOUPs (antistatic + strength)
• Adding functional fillers to resin compounds

An extra fine fiber with aspect ratio of length = 1 to 15um by diameter = 200 to 800nm.
It can aim for higher electrical / thermal conductivity than Carbon Nano Fiber for conductivity, ALP-NB1 thanks to higher dispersion.
Thermal conductivity is 550W/mK or more, and Volume resistivity is 1.E-5Ωm or less as a powder filler.