ALMEDIO
https://www.almedio.co.jp/- Japan exhibitors
- Real
- TECHNO-FRONTIER 2026
- THERMAL ENGINEERING JAPAN
- Booth number
Almedio carbon nanofibers have diameters of 200–800 nm and lengths of 1–20 µm. They offer excellent electrical and thermal conductivity and can be compounded into resins for electromagnetic (radar) absorption. They also improve mechanical strength and modulus, enabling lightweight, thin-wall molded parts.
In thermal management applications, their superior thermal conductivity and dispersion enhance heat dissipation in resin materials, making them effective for electronic devices and components. Their compatibility with complex shapes further improves flexibility in thermal design and supports efficient heat countermeasures.
Launched in April 2019, and we develop, produce, and process nano-products for a wide range of fields, including aerospace, automotive, medical, and sports and leisure. We also produce CNF-based resin compounds and the develop conductive paints, we aim for further growth as a functional materials manufacturer with our main thermal insulation business.
Exhibit Product
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Carbon Nano Fiber (CNF) for conductivity (HD) : ALP-NK1
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Target Sector (English)
・Automotive manufacturers and automotive parts manufacturers (needs for lightweighting and increasing strength)
・Electronic component manufacturers (antistatic and conductive applications)
・Semiconductor-related companies (FOUPs, transport containers, ESD countermeasures)
・Battery and energy-related manufacturers (heat dissipation and conductive materials)
・Resin compound manufacturers (functional filler applications)
・Precision equipment manufacturers (reinforcement of thin-walled and micro-components)
・Home appliance manufacturers (lightweighting and increasing rigidity of housings)
・Aerospace-related manufacturers (high-strength, lightweight composite materials)
・Sports and leisure goods manufacturers (high-performance materials)
・EMI/electromagnetic wave countermeasure material manufacturers (shielding and absorption applications)
・Chemical manufacturers (composite material development and dispersion technology applications) -
Use Scenes (English)
• Improving the strength and rigidity of resin molded products (lightweighting and thinning)
• Lightweighting and increasing the strength of automotive parts (brackets, covers, etc.)
• Antistatic and conductive properties of electronic components (ESD countermeasures)
• Static electricity countermeasures and improved durability of semiconductor transport containers (FOUPs)
• Improved heat dissipation of heat sinks and housings (thermal countermeasures materials)
• Conductive additives for battery-related applications
• Use as EMI shielding material and electromagnetic wave absorbing material
• Reinforcement of precision and micro-components (connectors, small gears, etc.)
• Reduced wear and extended lifespan of sliding parts
• Improving the performance of composite materials such as CFRP (improved interlayer strength)
• Adding functionality to transport materials such as conductive trays and FOUPs (antistatic + strength)
• Adding functional fillers to resin compounds -
Sales point (English)
An extra fine fiber with aspect ratio of length = 1 to 15um by diameter = 200 to 800nm.
It can aim for higher electrical / thermal conductivity than Carbon Nano Fiber for conductivity, ALP-NB1 thanks to higher dispersion.
Thermal conductivity is 550W/mK or more, and Volume resistivity is 1.E-5Ωm or less as a powder filler.
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Target Sector (English)
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Carbon Nano Fiber (CNF) for conductivity : ALP-NB1
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Target Sector (English)
Automotive manufacturers and automotive parts manufacturers (needs for lightweighting and increasing strength)
Electronic component manufacturers (antistatic and conductive applications)
Semiconductor-related companies (FOUPs, transport containers, ESD countermeasures)
Battery and energy-related manufacturers (heat dissipation and conductive materials)
Resin compound manufacturers (functional filler applications)
Precision equipment manufacturers (reinforcement of thin-walled and micro-components)
Home appliance manufacturers (lightweighting and increasing rigidity of housings)
Aerospace-related manufacturers (high-strength, lightweight composite materials)
Sports and leisure goods manufacturers (high-performance materials)
EMI/electromagnetic wave countermeasure material manufacturers (shielding and absorption applications)
Chemical manufacturers (composite material development and dispersion technology applications) -
Use Scenes (English)
• Improving the strength and rigidity of resin molded products (lightweighting and thinning)
• Lightweighting and increasing the strength of automotive parts (brackets, covers, etc.)
• Antistatic and conductive properties of electronic components (ESD countermeasures)
• Static electricity countermeasures and improved durability of semiconductor transport containers (FOUPs)
• Improved heat dissipation of heat sinks and housings (thermal countermeasures materials)
• Conductive additives for battery-related applications
• Use as EMI shielding material and electromagnetic wave absorbing material
• Reinforcement of precision and micro-components (connectors, small gears, etc.)
• Reduced wear and extended lifespan of sliding parts
• Improving the performance of composite materials such as CFRP (improved interlayer strength)
• Adding functionality to transport materials such as conductive trays and FOUPs (antistatic + strength)
• Adding functional fillers to resin compounds -
Sales point (English)
An extra fine fiber with aspect ratio of length = 1 to 20um by diameter = 200 to 800nm. It can aim for higher electrical / thermal conductivity thanks to higher graphitization degree than Carbon Nano Fiber for reinforcement. Thermal conductivity is 500W/mK or more, and Volume resistivity is 1.E-5Ωm or less as a powder filler.
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Target Sector (English)
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Carbon Nano Fiber (CNF) for high conductivity : ALP-NH1
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Target Sector (English)
・Automotive manufacturers and automotive parts manufacturers (needs for lightweighting and increasing strength)
・Electronic component manufacturers (antistatic and conductive applications)
・Semiconductor-related companies (FOUPs, transport containers, ESD countermeasures)
・Battery and energy-related manufacturers (heat dissipation and conductive materials)
・Resin compound manufacturers (functional filler applications)
・Precision equipment manufacturers (reinforcement of thin-walled and micro-components)
・Home appliance manufacturers (lightweighting and increasing rigidity of housings)
・Aerospace-related manufacturers (high-strength, lightweight composite materials)
・Sports and leisure goods manufacturers (high-performance materials)
・EMI/electromagnetic wave countermeasure material manufacturers (shielding and absorption applications)
・Chemical manufacturers (composite material development and dispersion technology applications) -
Use Scenes (English)
• Improving the strength and rigidity of resin molded products (lightweighting and thinning)
• Lightweighting and increasing the strength of automotive parts (brackets, covers, etc.)
• Antistatic and conductive properties of electronic components (ESD countermeasures)
• Static electricity countermeasures and improved durability of semiconductor transport containers (FOUPs)
• Improved heat dissipation of heat sinks and housings (thermal countermeasures materials)
• Conductive additives for battery-related applications
• Use as EMI shielding material and electromagnetic wave absorbing material
• Reinforcement of precision and micro-components (connectors, small gears, etc.)
• Reduced wear and extended lifespan of sliding parts
• Improving the performance of composite materials such as CFRP (improved interlayer strength)
• Adding functionality to transport materials such as conductive trays and FOUPs (antistatic + strength)
• Adding functional fillers to resin compounds -
Sales point (English)
An extra fine fiber with aspect ratio of length = 1 to 20um by diameter = 200 to 800nm. It can aim for higher electrical / thermal conductivity than Carbon Nano Fiber for conductivity, ALP-NK1. Thermal conductivity is 900W/mK or more, and Volume resistivity is 1.E-6Ωm or less as a powder filler.
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Target Sector (English)
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Silicon carbide (SiC)
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Target Sector (English)
• Power semiconductor and power supply manufacturers
• Automotive (EV/xEV) manufacturers / Tier 1
• Power supply and energy equipment manufacturers
• Semiconductor manufacturing equipment manufacturers
• Communications and data center related
• LED and optical equipment manufacturers
• Aerospace and heavy industry -
Use Scenes (English)
• Heat dissipation substrates for power semiconductors (SiC devices)
• Heat sink and heat spreader materials
• High-temperature ceramic components (for environments above 300°C)
• Furnace jigs and heat treatment equipment components
• Insulating heat dissipation materials (electrical insulation + high thermal conductivity)
• Power module substrates -
Sales point (English)
Silicon carbide (SiC) is a compound of silicon (Si) and carbon (C), known for its extreme hardness, heat resistance, and chemical resistance. Its excellent high-temperature heat resistance makes it suitable for semiconductor materials, and it is also used as a ceramic heater component, taking advantage of its high thermal conductivity as a ceramic material.
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Target Sector (English)
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Silicon, silicon compounds (Si, SiO, SiC, Si/C, etc.), and various other materials
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Target Sector (English)
• Power semiconductor and power supply manufacturers
• Automotive (EV/xEV) manufacturers / Tier 1
• Battery manufacturers
• Semiconductor manufacturing equipment manufacturers
• Communications and data center related companies
• LED and optical equipment manufacturers
• Aerospace and heavy industry -
Sales point (English)
High-Purity Silicon/Si-Based Materials: Stable Supply from Small Lots
We offer a wide range of high-quality **silicon and silicon compounds (Si, SiO, SiC, Si/C, etc.)** for secondary battery materials, resin additives, and various industrial materials.
With high purity, stable supply, and the ability to handle small lot orders, we support our customers from R&D to mass production.
We also accept requests for various materials, compounds, and alloys other than silicon.
Please feel free to inquire at our booth.
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Target Sector (English)