thermal resistance and thermal conductivity measurements Chemitox

This service is aimed at engineers and designers tackling thermal management challenges, as well as procurement and planning personnel considering outsourced testing — at manufacturers of power devices and power modules across the automotive, electrical, railway, and industrial machinery sectors.
Ideal for those with the following needs:
Quantitative thermal resistance characterization of high-heat-generating power devices, such as inverters and on-board chargers for EVs and HEVs
Obtaining standards-compliant data (JEDEC, ASTM, etc.) through outsourcing, due to limited in-house thermal evaluation capability
Data-driven selection and performance comparison of TIMs (thermal greases, thermal pads, etc.) between power devices and heat sinks
Isolating and evaluating thermal resistance of internal structural components (die attach, insulating substrate, heat spreader, etc.) for design improvement or failure analysis
Finding a partner handling everything from sample mounting through measurement and analysis, for both mass-produced products and prototypes
Applicable across a broad range of project phases, from upstream thermal design through downstream reliability evaluation.

① Thermal Design & Development Validation
θjc is measured via transient thermal resistance measurement (T3STER) per JEDEC JESD51-14. Structure function analysis separates thermal and contact resistance layer by layer (die attach, insulating substrate, heat spreader, etc.), supporting bottleneck identification and design improvement.
② TIM Selection & Material Evaluation
Thermal conductivity and thermal resistance of TIM candidates (greases, pads, etc.) are quantitatively evaluated referencing ASTM D5470. Using an actual power device as the heat source yields results reflecting real-world conditions beyond catalog values.
③ PCB Thermal Evaluation
In-plane and through-thickness thermal resistance of high-thermal-conductivity substrates (metal, ceramic, etc.) are evaluated via steady-state method per JPCA standards. Full support from TEG chip mounting through measurement and analysis.
④ Quality Control & Failure Analysis
Structure function analysis enables non-destructive identification of solder degradation or delamination when thermal variations are suspected. Comparison between defective and reference samples allows rapid fault localization at the material and bonding level.

① Visualizing Internal Device Structure via Structure Function Analysis
Going beyond a single thermal resistance value, structure function analysis visualizes the thermal resistance of each internal component layer by layer, providing powerful support for design improvement, material selection, and failure analysis.
② One-Stop Support from Sample Mounting to Measurement and Analysis
For bare substrate samples without a power device structure, we procure and mount semiconductor chips in-house to fabricate surrogate devices for testing. Regardless of sample condition, we provide full support including pre-measurement preparation, minimizing customer burden and enabling fast turnaround.
③ TIM Evaluation Under Conditions Close to Real-World Use
By using an actual power device as the heat source for thermal conductivity measurement, data is obtained under conditions closely reflecting actual operating environments. This contributes to more accurate thermal design based on realistic thermal resistance values. Compatible with all TIM types including pads, greases, and phase-change materials.