Chemitox

[Migration Test / CAF Resistance Test]
・PCB and substrate material manufacturers
Insulation reliability evaluation and quality assurance for printed circuit boards and substrate materials.

As wiring continues to shrink, layer counts increase, and mounting density rises, the risk of insulation degradation due to ion migration and CAF is growing. This service is ideal for customers seeking to assess these latent insulation failure risks.

[HAST/PCT]
・Electronic component and semiconductor manufacturers
Reliability evaluation of semiconductor packages, electronic components, and sensors.
・PCB manufacturers
Durability evaluation of substrate materials and insulation structures under high-temperature, high-humidity conditions.
・Development engineers in automotive and industrial sectors
Lifetime evaluation and quality assurance for high-reliability products including EVs, ADAS systems, industrial equipment, and communications devices.

[Migration Test / CAF Resistance Test]
・Insulation reliability evaluation of PCBs
Voltage is applied continuously under high-temperature, high-humidity conditions to evaluate insulation degradation and ion migration.
・CAF evaluation of multilayer substrates
Assesses CAF (Conductive Anodic Filament) formation risk between through-holes and interlayer insulation regions to support long-term reliability improvement.
・Comparative evaluation after material or structural changes
Evaluates the impact on insulation reliability when changing substrate materials, resin, glass cloth specifications, or pattern design.

[HAST/PCT]
・Accelerated lifetime evaluation
Samples are exposed to elevated temperature, humidity, and pressure to accelerate degradation and enable rapid lifetime assessment.
・Combined testing with migration testing
Voltage application during HAST/PCT enables composite stress evaluation of insulating materials and electronic components.

HAST uses unsaturated pressurized steam to rapidly reproduce moisture absorption and degradation. PCT uses saturated steam (100%RH), inducing surface condensation, and is suited for verifying structural resistance to moisture ingress.

[Migration Test / CAF Resistance Test]
・Among the largest testing capacities in Japan
With over 700 migration tester channels, simultaneous evaluation of a large number of samples is possible.
・High-voltage capability up to 3,000 V
In addition to standard migration testing, insulation reliability evaluation under high-voltage conditions is also supported.
・Continuous micro-current monitoring
Continuous measurement of micro-currents enables tracking of not only breakdown events but also the progression of degradation over time.

[HAST/PCT]
・High acceleration performance
By combining elevated temperature and humidity with pressurized conditions, degradation phenomena that would otherwise require extended periods can be evaluated in a short timeframe.
・Voltage application capability
In combination with a migration tester, voltage application up to 1 kV and insulation resistance measurement are supported.
・Broad equipment lineup
Both single-chamber and dual-chamber units are available, enabling flexible accommodation of different test requirements and sample sizes.

This service is aimed at engineers and designers tackling thermal management challenges, as well as procurement and planning personnel considering outsourced testing — at manufacturers of power devices and power modules across the automotive, electrical, railway, and industrial machinery sectors.
Ideal for those with the following needs:
Quantitative thermal resistance characterization of high-heat-generating power devices, such as inverters and on-board chargers for EVs and HEVs
Obtaining standards-compliant data (JEDEC, ASTM, etc.) through outsourcing, due to limited in-house thermal evaluation capability
Data-driven selection and performance comparison of TIMs (thermal greases, thermal pads, etc.) between power devices and heat sinks
Isolating and evaluating thermal resistance of internal structural components (die attach, insulating substrate, heat spreader, etc.) for design improvement or failure analysis
Finding a partner handling everything from sample mounting through measurement and analysis, for both mass-produced products and prototypes
Applicable across a broad range of project phases, from upstream thermal design through downstream reliability evaluation.

① Thermal Design & Development Validation
θjc is measured via transient thermal resistance measurement (T3STER) per JEDEC JESD51-14. Structure function analysis separates thermal and contact resistance layer by layer (die attach, insulating substrate, heat spreader, etc.), supporting bottleneck identification and design improvement.
② TIM Selection & Material Evaluation
Thermal conductivity and thermal resistance of TIM candidates (greases, pads, etc.) are quantitatively evaluated referencing ASTM D5470. Using an actual power device as the heat source yields results reflecting real-world conditions beyond catalog values.
③ PCB Thermal Evaluation
In-plane and through-thickness thermal resistance of high-thermal-conductivity substrates (metal, ceramic, etc.) are evaluated via steady-state method per JPCA standards. Full support from TEG chip mounting through measurement and analysis.
④ Quality Control & Failure Analysis
Structure function analysis enables non-destructive identification of solder degradation or delamination when thermal variations are suspected. Comparison between defective and reference samples allows rapid fault localization at the material and bonding level.

① Visualizing Internal Device Structure via Structure Function Analysis
Going beyond a single thermal resistance value, structure function analysis visualizes the thermal resistance of each internal component layer by layer, providing powerful support for design improvement, material selection, and failure analysis.
② One-Stop Support from Sample Mounting to Measurement and Analysis
For bare substrate samples without a power device structure, we procure and mount semiconductor chips in-house to fabricate surrogate devices for testing. Regardless of sample condition, we provide full support including pre-measurement preparation, minimizing customer burden and enabling fast turnaround.
③ TIM Evaluation Under Conditions Close to Real-World Use
By using an actual power device as the heat source for thermal conductivity measurement, data is obtained under conditions closely reflecting actual operating environments. This contributes to more accurate thermal design based on realistic thermal resistance values. Compatible with all TIM types including pads, greases, and phase-change materials.

・High-voltage, high-reliability products
Power devices and power modules for EVs and HEVs, industrial equipment, power supply units, and high-voltage applications.
・R&D of insulating and substrate materials
PCB manufacturers, substrate material manufacturers, encapsulant manufacturers, and electronic component manufacturers evaluating new materials for adoption or reliability qualification.

As higher voltage, higher power output, and higher-density packaging become the norm, insulating materials are held to ever-stricter reliability requirements. This service supports customers in addressing challenges related to lifetime prediction and reliability evaluation, from material selection through quality assurance.

・Comparison and selection of new materials
Long-term insulation performance of candidate insulating materials, encapsulants, and substrate materials can be comparatively evaluated to support optimal material selection.
・Lifetime prediction during product development and design
V-t (Voltage-time) testing characterizes the relationship between applied voltage and time-to-breakdown, enabling estimation of insulation lifetime under actual operating voltages. Results serve as the basis for design margin setting and reliability-driven design decisions.
・Durability evaluation under high-temperature, high-humidity conditions
Testing is conducted under accelerated aging conditions including 85°C/85%RH, enabling long-term reliability evaluation under anticipated field environments.
・Failure analysis and quality improvement
For issues related to insulation degradation or breakdown, we provide data on degradation behavior and lifetime prediction to support quality improvement and recurrence prevention.

・Lifetime estimation under realistic operating conditions
V-t characteristics are derived from the relationship between applied voltage and time-to-breakdown, enabling estimation of insulation lifetime under actual operating voltage conditions — capturing time-dependent degradation that conventional withstanding voltage tests cannot.
・High-voltage capability
Voltage application up to AC/DC 10 kV is supported, enabling evaluation of insulating materials and substrate structures for high-voltage applications.
・Detailed characterization of insulation degradation behavior
Using a migration tester, micro-current monitoring tracks not only breakdown events but also the progression of degradation over time.
・Compatibility with a wide range of sample types
Supported materials include printed circuit boards, ceramic substrates, and metal-base substrates, as well as various insulating resins and film materials.
・One-stop support from test planning to analysis
We handle everything from proposing test conditions suited to the evaluation objective and product structure, through test execution and data analysis. Customers new to V-t testing can proceed with confidence.

【PCB manufacturers】
・Insulation performance evaluation of substrate materials
・Surface insulation reliability evaluation
・Quality verification of development and mass-production samples
【Polymer material manufacturers】
・Electrical characterization of resins, films, sheets, rubber, and similar materials
・Performance comparison during material development
・Quality control and standards compliance verification
【Electronic component packaging manufacturers】
Electrostatic protection performance evaluation of materials including:
・Conductive trays
・Carrier tapes
・Packaging films
・Transport containers
【Insulating material manufacturers】
・Insulating sleeves
・Insulating tubes
・Insulating sheets
・Insulating films

Testing can be combined with environmental conditioning to assess degradation before and after exposure. Flexible accommodation of non-standard sample geometries is also available.

【Volume and surface resistivity of PCBs and polymer materials】
Evaluates insulation and antistatic performance. Voltage is applied through the sample surface for surface resistance, or through the thickness direction for volume resistance.
【Volume resistivity of insulating sleeves and tubes】
Supports special-geometry samples such as sleeves and tubes that cannot be configured with the standard double-ring electrode method.
【Resistance measurement of conductive packaging materials】
Conventional packaging materials can accumulate and discharge static electricity, potentially damaging electrostatic discharge sensitive (ESDS) devices. Material characterization is performed to evaluate packaging designed to prevent such damage.
【Insulation resistance measurement】
Covers interlayer insulation resistance of copper-clad laminates, pattern-to-pattern insulation resistance of PCBs, and two-point insulation resistance of electronic components and finished products.

Current flowing through a sample under applied voltage is measured, and volume or surface resistivity is calculated based on sample dimensions and electrode configuration. Insulation resistance values up to 1.0×10¹⁷ Ω are measurable. Evaluation under various temperature and humidity conditions is supported through combination with a temperature/humidity chamber.
〇Standards compliance
JIS C2139-3-1, -3-2, -3-3 / JIS C5012 / JIS C5016 / JIS C6471 / JIS C6481 / JIS K6911 / ASTM D257 / IPC-TM-650 2.5.17, 2.5.17.1 / IEC 60684-2 / ANSI/ESD STM11.11, STM11.12, STM11.13

〇Temperature and humidity conditions
Controlled temperature and humidity environments
Low-humidity environments (15%RH and below)

〇Flexible accommodation of custom requirements
Electrode formation and testing per individual specifications are supported, as are special-geometry samples such as insulating sleeves and tubes.