U-MAP/ Okamoto Glass
https://umap-corp.com/- Japan exhibitors
- Real
- TECHNO-FRONTIER 2025
- THERMAL ENGINEERING JAPAN
- Booth number 3-BB20
At U-MAP’s booth, we will showcase next-generation thermal solutions powered by our proprietary technology “Thermalnite®”, developed at Nagoya University.
Our exhibit focuses on three main offerings:
High-Performance Thermal Interface Sheet (FiBCool®)
Combines high thermal conductivity and flexibility. Ideal for thermal challenges in PCs, LEDs, power modules, and more.
Ceramic Substrates (U-MAP Substrate)
AlN composite substrates with superior heat resistance and reliability. Suited for power electronics and automotive applications.
Contract & Joint Development Using Thermalnite®
Leverage our unique fibrous aluminum nitride single crystal technology to co-create customized thermal materials and formulations.
Engineers seeking innovative thermal solutions are warmly invited to visit our booth.
Exhibit Product
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High-Strength Ceramic Substrate (AlN Substrate)
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Target Sector (English)
Power module and LED manufacturers, communication equipment manufacturers, automotive electronics manufacturers
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Use Scenes (English)
Substrates for automotive inverters, sterilization LEDs, railway motors, UPS power supplies, etc.
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Sales point (English)
・Highest mechanical strength and thermal conductivity ever achieved in AlN
・Enhanced fracture toughness and crack resistance using fibrous AlN
・Excellent workability combined with high insulation performance
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Target Sector (English)
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Hybrid Filler
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Target Sector (English)
TIM sheet manufacturers, adhesive and encapsulant manufacturers, thermal resin compound producers
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Use Scenes (English)
As a filler for grease, gap fillers, and phase change materials (PCMs)
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Sales point (English)
・Combines in-plane thermal conductivity of Thermalnite with enhanced through-plane conductivity using spherical AlN
・Achieves both high thermal conductivity and flexibility with low loading
・Surface treatment with silane improves dispersibility, processability, and moisture resistance
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Target Sector (English)
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Low Thermal Resistance Sheet (FibCool)
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Target Sector (English)
Thermal management engineers in power electronics, automotive electronics, LED lighting, and servers
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Use Scenes (English)
Heat dissipation in high-power devices such as CPUs, GPUs, SSDs, automotive ECUs, power modules, LEDs, and base stations
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Sales point (English)
・Extremely low thermal resistance with excellent softness and compressibility
・High adhesion to both smooth and uneven surfaces
・Enhances heat dissipation efficiency while reducing thermal stress
・Ideal for applications requiring thin, flexible thermal interface materials
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Target Sector (English)
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Thermalnite®(Fibrous Aluminum Nitride Single Crystal)
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Target Sector (English)
Materials developers, thermal management material manufacturers, adhesive and resin manufacturers
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Use Scenes (English)
As a filler for thermal grease, adhesives, encapsulants, and resin compounds
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Sales point (English)
・The world’s only fibrous AlN single-crystal filler
・Achieves high thermal conductivity and mechanical strength even with low loading
・Excellent insulation, low dielectric constant, and high conformability
・Available in water-resistant grade
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Target Sector (English)