High-Strength Ceramic Substrate (AlN Substrate) U-MAP/ Okamoto Glass
- Materials
- Insulator
- Thermal Design / Technology (Analysis software, etc.)
- Heat Countermeasure Parts
- Heat Management Materials (Substrate, Elastic Materials, etc.)
- Heat Management Products / Systems (Heatsink, Radiator plate, etc.)
-
Target Sector (English)
Power module and LED manufacturers, communication equipment manufacturers, automotive electronics manufacturers
-
Use Scenes (English)
Substrates for automotive inverters, sterilization LEDs, railway motors, UPS power supplies, etc.
-
Sales point (English)
・Highest mechanical strength and thermal conductivity ever achieved in AlN
・Enhanced fracture toughness and crack resistance using fibrous AlN
・Excellent workability combined with high insulation performance
| Size / capacity (English) | Size: 4.5-inch square Thickness: 0.2–1.0 mm Flexural Strength: 350 MPa Thermal Conductivity: 170・200 W/m·K |
|---|---|
| Notices (English) | Significantly suppresses cracking during reflow soldering and assembly processes. Compatible with laser processing, polishing, metallization, and other post-processing steps. |
| Catalog PDF file |
U-MAP/ Okamoto Glass
https://umap-corp.com/- Japan exhibitors
- Real
- TECHNO-FRONTIER 2025
- THERMAL ENGINEERING JAPAN
- Booth number 3-BB20