Low Thermal Resistance Sheet (FibCool) U-MAP/ Okamoto Glass
- Power Supply Parts
- Automotive
- Industrial Machinery
- Insulator
- Thermal Design / Technology (Analysis software, etc.)
- Heat Countermeasure Parts
- Heat Management Materials (Substrate, Elastic Materials, etc.)
- Heat Management Products / Systems (Heatsink, Radiator plate, etc.)
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Target Sector (English)
Thermal management engineers in power electronics, automotive electronics, LED lighting, and servers
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Use Scenes (English)
Heat dissipation in high-power devices such as CPUs, GPUs, SSDs, automotive ECUs, power modules, LEDs, and base stations
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Sales point (English)
・Extremely low thermal resistance with excellent softness and compressibility
・High adhesion to both smooth and uneven surfaces
・Enhances heat dissipation efficiency while reducing thermal stress
・Ideal for applications requiring thin, flexible thermal interface materials
| Size / capacity (English) | Size: A4 (other sizes negotiable) Thickness: 0.1, 0.2, 0.5, 1.0 mm Thermal Conductivity: 4.3 W/m·K Tensile Strength: 0.43 MPa Dielectric Breakdown Voltage: 0.83 kV |
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| Notices (English) | Achieves high performance with the addition of Thermalnite®. Contributes to device miniaturization and extended lifespan through improved cooling efficiency. |
| Catalog PDF file |
U-MAP/ Okamoto Glass
https://umap-corp.com/- Japan exhibitors
- Real
- TECHNO-FRONTIER 2025
- THERMAL ENGINEERING JAPAN
- Booth number 3-BB20