INCUBATION ALLIANCE
https://incu-alliance.co.jp/company/- Japan exhibitors
- Real
- TECHNO-FRONTIER 2026
- THERMAL ENGINEERING JAPAN
- Booth number 3-F26

Exhibit Product
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A high heat conductor with more than twice the thermal conductivity of copper GRAPHENE BLOCK
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Target Sector (English)
Manufacturers of power devices and GPUs with high heat generation, heat-dissipating material makers, and semiconductor equipment manufacturers that need advanced heat control and heat exchange.
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Use Scenes (English)
Alternatives to copper heat-dissipating parts, like cold plates
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Sales point (English)
It has more than twice the thermal conductivity of copper, and you can control the direction of heat transfer depending on how you cut it. It’s also lightweight, with a quarter of copper’s density.
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Target Sector (English)
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Graphene filler that gives thermal and electrical conductivity GRAPHENE FILLER
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Graphene porous material GRAPHENE FOAM
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Target Sector (English)
Companies looking for carbon-based materials to fill the gap between heat sources and cooling devices in high-temperature environments
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Use Scenes (English)
It can fill the gaps at interfaces caused by thermal expansion in high-temperature environments, and can be applied to places where you want good contact and heat transfer. Example prototype: thermal interface material for EV battery cases.
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Sales point (English)
Heat resistant (in air: 500°C, in inert gas: 3000°C)
Graphene forms a 3D framework, giving it high thermal conductivity and electrical conductivity. By impregnating it with resin or other materials, it can gain curvature and flexibility.
Size: 90 x 360 x 1.5 mm, thermal conductivity in the thickness direction is 10 W/m·K.
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Target Sector (English)
