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In recent years, advancements in AI and Software-Defined Vehicles (SDVs) have driven the increased output and high-density integration of high-performance SoCs, such as GPUs, as well as GaN and SiC power devices. As a result, heat generation density has risen rapidly, leading to the emergence of thermal challenges that cannot be adequately addressed by conventional thermal design methods.
FGHP, a stacked vapor chamber, offers high strength at elevated temperatures and features a radially designed internal structure that enables the rapid dispersion of locally concentrated heat across the entire cooling surface. As a result, it delivers superior heat transport performance that cannot be achieved with homogeneous materials.
These characteristics make FGHP an effective thermal management solution for increasingly advanced and high-performance SoCs and power devices.
