Taiyo Wire Cloth

FGHP™: the world’s highest-performance ultra-thin vapor chamber

• Use Scenes (English)

  In recent years, advancements in AI and Software-Defined Vehicles (SDVs) have driven the increased output and high-density integration of high-performance SoCs, such as GPUs, as well as GaN and SiC power devices. As a result, heat generation density has risen rapidly, leading to the emergence of thermal challenges that cannot be adequately addressed by conventional thermal design methods.
  FGHP, a stacked vapor chamber, offers high strength at elevated temperatures and features a radially designed internal structure that enables the rapid dispersion of locally concentrated heat across the entire cooling surface. As a result, it delivers superior heat transport performance that cannot be achieved with homogeneous materials.
  These characteristics make FGHP an effective thermal management solution for increasingly advanced and high-performance SoCs and power devices.

• Sales point (English)

  *High heat spreading capability
  *High strength (heat-resistant up to 245°C)
  *Flexible orientation (installation in any position)
  *Custom design available (miniaturization / multiple heat sources / bare-chip mounting)

Thermal interface material