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DATE
July 23(Wed) - 25(Fri), 2025
VENUE
Tokyo Big Sight West Halls 1, 2, 3, 4

Graphene heat dissipation parts INCUBATION ALLIANCE

  • Materials
  • Power Supply Parts
  • Semiconductor
  • Power Line Control
  • Automotive
  • Industrial Machinery
  • Consumer
  • Thermal Design / Technology (Analysis software, etc.)
  • Heat Countermeasure Parts
  • Heat Management Materials (Substrate, Elastic Materials, etc.)
  • Heat Management Products / Systems (Heatsink, Radiator plate, etc.)
  • Information instrument
  • Information device
  • Target Sector (English)

    Power devices, home appliances, automotive, communication devices,

  • Use Scenes (English)

    XY heat dissipation
    XZ heat transfer

Size / capacity (English) heat dissipation  XY  100X70X0.3㎜~
heat transfer   XZ  100X2.0X100mm
Notices (English) It has a thermal conductivity of 1000W/m.K in the in-plane direction and 20W/m.K in the direction perpendicular to the orientation. It can be plated with metals such as gold, silver, copper, and Ni, which helps prevent dust generation and metallization.
Catalog PDF file

INCUBATION ALLIANCE

https://incu-alliance.co.jp/company/
  • Japan exhibitors
  • Real
  • TECHNO-FRONTIER 2025
  • THERMAL ENGINEERING JAPAN
  • Booth number 3-DD25