Graphene heat dissipation parts INCUBATION ALLIANCE
- Materials
- Power Supply Parts
- Semiconductor
- Power Line Control
- Automotive
- Industrial Machinery
- Consumer
- Thermal Design / Technology (Analysis software, etc.)
- Heat Countermeasure Parts
- Heat Management Materials (Substrate, Elastic Materials, etc.)
- Heat Management Products / Systems (Heatsink, Radiator plate, etc.)
- Information instrument
- Information device
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Target Sector (English)
Power devices, home appliances, automotive, communication devices,
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Use Scenes (English)
XY heat dissipation
XZ heat transfer
Size / capacity (English) | heat dissipation XY 100X70X0.3㎜~ heat transfer XZ 100X2.0X100mm |
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Notices (English) | It has a thermal conductivity of 1000W/m.K in the in-plane direction and 20W/m.K in the direction perpendicular to the orientation. It can be plated with metals such as gold, silver, copper, and Ni, which helps prevent dust generation and metallization. |
Catalog PDF file |
INCUBATION ALLIANCE
https://incu-alliance.co.jp/company/- Japan exhibitors
- Real
- TECHNO-FRONTIER 2025
- THERMAL ENGINEERING JAPAN
- Booth number 3-DD25