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Sales point (English)
Provides information on the thermal design of surface mount chip components
[Exhibition overview]
・Changes in component thermal management due to revision of IEC60115-8
・Demonstration of temperature measurement by thermograph
・Heat dissipation measures for small, high heat generating components
etc
KOA
https://www.koaglobal.com/- Japan exhibitors
- Real
- TECHNO-FRONTIER 2025
- POWER SUPPLY JAPAN
- Booth number 4-B31