Conductive Ni-P particle plating technology (nickel-phosphorus) Proterial

1. Chiplet 2.5G mounting materials
2. Gap materials for die attach paste
3. Conductive particles for anisotropic conductive f

1. Chiplet 2.5G mounting materials
2. Gap materials for die attach paste
3. Conductive particles for anisotropic conductive f

1. High sphericity and uniform particle size
2. Low electrical resistance with various plating types
3. Heat resistance and high hardness of Ni-P particle core