COPER ELECTRONICS

https://www.copernics.co.jp/

• Japan exhibitors
• Real

• TECHNO-FRONTIER 2025
• POWER ELECTRONICS JAPAN
• Booth number

●Demonstration of dynamic characteristics test
　・SiC (mold package, module package)
　・Si-IGBT/DIODE (Chip)
●Panel exhibition of static characteristic testing machines, thermal resistance testing machines, and power cycle testing machines.